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|  TM
11-5820-919-40-1
8.
If the repair appears wet and well
WARNING
bonded, install and solder an eyelet as
Adhesives are irritating to the
described in steps 3 thru 7 of paragraph
3-23.
skin and eyes upon contact, and
Use
may emit harmful vapor.
only with adequate ventilation.
Avoid all skin and eye contact.
REMOVAL OF BONDED PARTS.
A part
Use protective clothing such as
that has been bonded to a circuit card
rubber gloves, apron and eye
(with an epoxy adhesive or similar com-
Wash off immedi-
protection.
pound) can be removed after the leads
ately any accidentally contamin-
have been clipped or unsoldered by break-
Hand washing
ated skin area.
ing the defective part or by applying
facilities and eye wash foun-
heat to the bonding compound. The
tain should be provided. Do
method to be used depends on the type of
not take internally.
part and its location. If a defective
part cannot be removed by heat, cut or
break the part away from the bonding com-
Apply a thin, smooth coat of clear
3.
In some cases, the part to be
pound.
epoxy adhesive to the area from which
replaced is so closely positioned
the defective pad was removed.
between other parts that one lead must
be cut close to the body of the defec-
tive part to permit the application of a
Place the new pad, as nearly as
4.
prying tool. Wherever possible, cut the
possible, in the exact position of the
defective part with diagonal cutting
Insert a round, pointed
defective pad.
pliers.
toothpick in the hole to help in align-
Press the pad firmly in place
ment.
with an orange stick while gently remov-
ing the toothpick from the hole.
CAUTION
Never apply excessive pressure
against a circuit card.
Allow the epoxy adhesive to
set
5.
for 1 hour at room temperature.
3-26.
Regardless of the tool employed
(round-pointed or spade type), great
Carefully remove surplus adhesive
6.
care must be exercised in its use to
by using a clean cloth dipped in toluene
prevent the circuit card or other parts
or other suitable solvent.
from being damaged or broken. Apply the
point of the tool against the bonding
compound and between the part and the
WARNING
circuit card. Use the tool so that it
works away the bonding compound from the
Handling hot items presents a
part to be broken until enough has been
serious injury potential.
removed for the tool to exert pressure
Asbestos gloves are required.
against the part. Keep the leverage sur-
face area of the tool flat against the
surface of the circuit card to prevent
Cure the repaired pad in an oven
7.
the tool from gouging or breaking the
10 F or let it stand at room tempera-
board.
ture for 24 hours.
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