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Page Title:
Repair of Raised or Unbended Gold-Plated Copper Etch. |
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11-5820-919-40-1
Use a soldering iron to apply sol-
6.
Encapsulate the worked area with
15.
der to the eyelet and to the surrounding
polyurethane coating by the method
etch on both sides of the circuit card.
described in paragraph 3-33.
Repair of Raised or Unbended
WARNING
Raised or
Gold-Plated Copper Etch.
unbended gold-plated copper etch can be
Isopropyl alcohol is flammable.
Keep away from heat and open
repaired by performing the following
Vapors may be harmful.
flame.
steps:
Use with adequate ventilation.
Avoid prolonged or repeated
Determine the hole diameter
1.
breathing of vapor. Avoid eye
required for the new eyelet and select
Do not take internally.
contact.
an eyelet of similar size.
7.
Remove the soldering flux and
WARNING
clean the circuit card with isopropyl
alcohol.
Drilling operations create
REPLACEMENT OF A LIFTED PAD.
Lifted pads (circular etch surrounding
metal chips which may enter
the eyes and cause serious
either eyelets or plated-through holes
injury. Eye protection is
that have raised from the board) can be
required.
replaced by performing the following
steps:
Remove the lifted pad. If the
1.
If the hole is plated-through,
2.
hole has an eyelet, remove the eyelet
drill the hole to accommodate the new
first.
Be careful not to raise the
eyelet.
etch while drilling.
If the hole has an
WARNING
eyelet, remove the defective eyelet.
Toluene is flammable. Keep
3.
Use the eyelet press and dies to
away from heat and open flame.
insert and form the new eyelet; allow
Vapors are harmful. Use only
approximately 0.01 inch of etch to
with adequate ventilation.
Allow
extend beyond the eyelet rim.
Avoid prolonged or repeated
clearance under both of the formed heads
breathing of vapor. Avoid con-
so that solder flow under and around the
tact with skin and eyes. Do
formed heads will not be impaired.
Comply
not take internally.
with air pollution control
rules
concerning
photochemi-
4.
Insert a round toothpick, or
cally reactive solvents.
equivalent, in the eyelet hole to pre-
vent solder from entering the hole.
2.
Clean the area from which the
defective pad was removed with a clean
5.
Apply soldering flux with a brush
cloth moistened with toluene.
to the eyelet and surrounding etch.
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