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Page Title:
REMOVAL OF SOLDERED COMPONENTS HAVING AXIAL LEADS. |
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11-5820-919-40-1
REMOVAL OF SOLDERED COMPONENTS
solder has melted, in and around the
Components
with
HAVING AXIAL LEADS.
lead hold, quickly remove the solder
axial leads that are soldered in place
Repeat
with the solder-removing tool.
on the circuit card may be removed by
this procedure for each lead associated
performing the following steps:
with the component to be removed.
Use diagonal cutting pliers to cut
1.
Remove the
component
from
the
2.
the
leads of the component part close to
circuit card.
Carefully straighten the
the
component.
end
that extends through each hole so
REMOVAL OF TRANSISTORS. The
that
the lead may be easily withdrawn.
transistor connection points in a given
Therefore,
circuit may not be keyed.
2.
Use a vacuum resoldering unit, if
when replacing a transistor, it is pos-
available, to remove the solder from
sible to insert the replacement transis-
If a vacuum
each lead on the component.
tor backwards to reversing the emitter
resoldering unit is not available, exert
For this reason,
and collector leads.
a slight pressure and apply the tip of
before the transistor is unsoldered from
the soldering iron to the tip of the
the circuit, identify the emitter and
lead. Keep the soldering iron away from
collector terminals in the circuit.
the circuit etch. As the lead end
Mark the emitter terminal connection
absorbs heat, the solder will melt and
point in the circuit with a pencil, a
the lead will break away from its junc-
piece of chalk, or a crayon before
Remove the
tion with the circuit etch.
The
transistor
removing the transistor.
soldering iron immediately and quickly
may then be removed.
pull the lead free. Use the solder-
removing tool to remove excess solder.
SOLDERED
COMPONENT
REPLACEMENT.
Do not force or twist the load to remove
Horizontally mounted components rated at
it from the circuit card.
less than 1 watt and with pigtail leads
which are inserted in plated-through
Remove the
component
from
the
3.
eyelets or in unsupported holes should
circuit card.
be mounted flush with the board surface.
Components rated at 1 watt or more
REMOVAL OF SOLDERED COMPONENTS
should be mounted with 1/16-inch
Components
with
HAVING RADIAL LEADS.
clearance between the component and the
radial leads that are soldered in place
surface of the board.
on the circuit card may be removed by
the procedure described in paragraph
COMPONENT REPLACEMENT IN EYELETS.
3-29 if the leads are accessible on the
Components may be replaced in circuit
component side of the circuit card. If
cards which have eyelets by performing
the leads of the component are not
the following steps:
accessible on the component side of the
circuit board, the component may be
NOTE
removed by performing the following
steps:
See paragraph 3-30 for compo-
nent clearance requirements.
Use a vacuum resoldering unit, if
1.
available, to remove the solder from
Make certain that all the poly-
1.
If a vacuum
each lead on the component.
urethane coating has been removed from
resoldering unit is not available, exert
the pads on both sides of the circuit
a slight pressure and apply the tip of
card.
the soldering iron to the tip of the
Keep the soldering iron away from
lead.
Apply the well-tinned tip of the
2.
the circuit etch. As the lead absorbs
soldering iron as close as possible to
When the
heat, the solder will melt.
the eyelet-component lead intersection.
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