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Page Title:
REPAIR OF DEFECTIVE PLATED-THROUGH HOLE. |
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|  TM
11-5820-919-40-1
Remove the board from the oven and
6.
Using an X-acto knife, very care-
8.
allow it to cool to room temperature.
fully cut down into the wire just at, or
Remove the clamp(s).
ahead of, the point where it emerges
from the solder.
REPAIR OF DEFECTIVE PLATED-
THROUGH HOLE.
Defective
plated-through
holes can be repaired by performing the
NOTE
following steps.
The wire shall not extend past
the periphery of the pad to
NOTE
which it is soldered.
If there should be a component
placed in such a manner as to
7.
Grasp the free end of the wire and
interfere with the performance
lift it slowly so that it separates at
of this repair, remove that
the cut produced in step 6.
component according to the
procedure contained in para-
graph 3-27 or paragraph 3-28.
8.
Turn the circuit card over and
Handle this removed component
repeat steps 6 and 7 for the other side
with care because it may be
of the repair.
reinstalled upon the com-
pletion of this repair.
9. Apply a small amount of soldering
1.
Cut a length of 34-gage uninsu-
flux to each side of the repair, and
lated tin-coated wire from 50 to 100
using the soldering iron touch up the
millimeters (2 to 4 inches) long and
solder joints to cover any of the copper
pass it through the defective plated-
wire exposed by the trimming of the
through. hole.
If the wire will not
leads.
pass through the hole, due to solder
build-up, the hole may be cleared with
the use of a vacuum resoldering unit.
WARNING
Hold one end of the wire against
2.
Isopropyl alcohol is flammable.
one side of the circuit card and pull
Keep away from heat and open
the other end taut and down against the
flame. Vapors may be harmful.
other side of the circuit card, being
Use with adequate ventilation.
careful to avoid aligning the wire with
Avoid prolonged or repeated
any circuit traces emerging from the pad.
breathing of vapor. Avoid eye
contact. Do not take
Turn the circuit card over and
3.
internally.
repeat step 2 for the opposite side.
4.
Using solder, the soldering iron,
10.
Clean the repaired
area
with
isopropyl
alcohol.
to the pad using a minimum amount of
solder.
11.
If a component has been removed in
Turn the circuit card over and
5.
order to accomplish this repair, and if
repeat step 4 as required.
it is visually and mechanically sound,
replace that component according to the
CAUTION
procedure in paragraphs 3-30, 3-31, or
If the component is defective,
3-32.
Do not cut down into the cir-
replace it with an identical new
cuit card pad when trimming the
component.
wire.
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