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|  TM
11-5820-919-40-1
The
solder-plated
ETCH REPAIR.
5.
Inspect the repair to be certain
copper or gold-plated copper conductors
that the damaged area has been bridged
(etch) bonded to the surface of the cir-
by the solder.
cuit cards can be damaged when mishan-
dled or when a component failure causes
current flow that exceeds the current-
6.
Encapsulate the worked area by
the
carrying limits of the etch.
Certain
method described in paragraph 3-33.
types of damage to the etch can be
repaired by using the appropriate repair
Scratches or gouges on the
techniques.
Sol-
etch can be repaired by soldering.
Repair of Broken Gold-Plated
dering is also used to repair voids or
Copper Etch.
Broken or cut gold-plated
Breaks or cuts in
pinholes in the etch.
copper etch can be repaired by perform-
the etch can be repaired by bridging the
ing the following steps:
defect with a new section of etch.
Lifted, raised, or unbended etch can be
repaired by pressing the etch against
1.
With an X-acto knife, scrape the
the card surface and encapsulating the
polyurethane coating from the area of
defect with epoxy adhesive. Damaged
the circuit card to be repaired. Be
plated-through holes or eyelets are
careful not to cause further damage to
repaired by inserting and soldering an
the etch.
To repair damaged etch, per-
eyelet.
form the procedures of the following
paragraphs that apply to the type of
damage to be repaired.
2.
Cut out a section approximately
1/2 inch longer than the area to be
repaired from a strip of gold-plated
Repair of Scratched, Gouged,
copper ribbon (etch material).
Scratched,
Voided, or Pinholed Etch.
gouged, voided, or pinholed etch faults
can be repaired by performing the fol-
Tin the new piece of etch mate-
3.
lowing steps:
rial; use solder sparingly.
With an X-acto knife, scrape the
1.
polyurethane coating from the area of
Position the new etch material
the circuit card to be repaired. Be
4.
careful not to cause further damage to
over the damaged area so that it over-
the etch.
laps by 1/8 inch and hold it in place
with an orange stick.
Flatten any burrs that exist on
2.
Touch the soldering iron to one
5.
the defective area of the etch by using
end of the new etch material until the
the back of the recommended diagonal
solder flows to the damaged etch at that
cutting pliers, or equivalent.
end.
Use an orange stick to smooth out
Use a brush to apply soldering
3.
6.
flux to the etch where defect exists.
the new etch material, work toward the
unsoldered end; hold the new etch
material firmly in place with the orange
Use the soldering iron to apply
4.
solder to the defect. Use solder
stick, cut off the surplus, and allow
approximately 1/8 inch for overlap.
sparingly.
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