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11-5820-919-40-1
TM
SECTION
I
CIRCUIT
CARD
ASSEMBLY
REPAIR
PROCEDURES
GENERAL.
Excessive
Solder.
Solder  that
flows beyond the bend radius of a com-
This  section  contains  description
3-4.
ponent  lead  is  not  acceptable,  except
and  definitions  of  standards  to  be
for  small  diameter  components  (for
example,  glass  diodes).
The  maximum
ohserved  followed  by  procedures  to  be
solder  height, including  component  lead,
performed  for  repair  of  circuit  cards
Read  the
on the bottom of the board is 0.062 inch
and  replacement  of  components.
procedures  in  this  section  before
Solder  spikes  should  not
exceed  0.062  inch.
attempting  card  repair.
Insufficient  Solder.  Except  for
STANDARDS.
permissible  voids  and  pinholes,  the
solder must fill the hole to the point
SOLDERING  STANDARDS  FOR  CIRCUIT
The  following  paragraphs  contain
where  the  solder  covers  the  entire  inner
CARDS .
For  eyelet  holes
surface of the hole.
standards  to  be  observed  when  soldering
or  standoff  terminals  with  circuit  con-
circuit  cards.
nections,  the  solder  should  flow  between
Soldering
Voids. A void (fig 3-1)
the eyelet and the pad for at least four-
ifths  of  the  circumference.
is  area  which  is  not  filled  with
solder, the extent of which is com-
Cold  Solder  Joints.  Cold  solder
pletely  visible.  For  cards  with  eyelets
joints  (fig  3-4)  where  the  solder  balls
or  plated-through  holes,  voids  in  the
at the point of contact with a pad or
circuit side of a solder joint are per-
lead  are  not  acceptable.
missible,  provided  that  they  are  not
deeper than half of the hole depth and
Preferred
Solder
Connections.
do not extend over more than a quarter
If no" circuit is con-
of the hole area.
All  components  may  be  soldered  by  either
nected to the pad on the side of the
flow  soldering  or  by  hand  soldering.
The  completed  joint  must  have  a  clear,
void,  the void may extend over the
smooth  appearance  which  indicates  proper
entire hole area if the outline of the
Voids  in  unsupported
lead  is  visible.
soldering.  Examples  of  preferred  solder
connections  are  shown  in  figure  3-5.
holes  may  extend  through  the  hole  but
should not extend over more than a fifth
CIRCUIT  CARD  BASE  MATERIAL
of the hole area.
Cracks,  chips,  or  gouges  in
STANDARDS.
A pinhole is
Soldering  Pinholes.
the  base  material  should  not  exceed  the
a hole in the surface of the solder
following:
which  indicates  the  absence  of  solder
beneath  the  surface,  the  extent  of  which
1.
Cracks  or  chips  should  not  exceed
Pinholes  (fig  3-2)
is not visible.
back from the edge of the hole more than
should  not  be  permitted  adjacent  to  the
0.040  inch.
component  lead  or  wire.
Cracks,  chips,  and  gouges  at  the
2.
Solder  is  not  required
Pad Area.
edge of the board should not exceed 1/3
Voids  and
to cover the entire pad area.
of  the  board  thickness  or  extend  back
pinholes  in  these  areas  are  acceptable.
more than 0.12 inch from the edge.


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