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| TM 11-5820-509-35
head of this 6-32 screw, and a net washer, lock washer,
subassemblies or between individual
and hex nut above the chassis at the bracket end).
assemblies are removed to affect
repairs, tag each wire carefully so
NOTE
that it may be reconnected to its
If interconnecting wires between
proper terminal location.
subassemblies,
or
between
components
and
the
module
(2) Repair Procedures.
Replace any
connector must be removed to affect
defective component or repair the circuit using the
repairs, tag each wire carefully so
procedures outlined in section IV. Component parts
that it may be reconnected to its
shown on the module schematic diagram (fig. 7-3) are
prop. terminal location.
located in figures 3-52 and 3-53.
(c) Major piece parts that are mounted
CAUTION
directly to the chassis may be removed by first
Do not attempt to repair card
disconnecting the component lead and then removing
assembly E2. This subassembly and
the mounting hardware that secures the component to
the encapsulated crystal circuit must
the module chassis.
be carefully removed and returned to
the depot for repair and adjustment.
(2) Repair Procedures.
Replace any
Failure to do so may result in off-
defective component or repair the circuit using the
frequency operation or malfunction
procedures outlined in section IV. Component parts
of the equipment. When using a
shown on the module schematic (fig. 7-12) are located
soldering iron to remove or replace a
in figures 3-45 through 3-51.
component part, use only enough
head to cause solder to flow. Excess
CAUTION
heat can damage the component and
When using a soldering iron to
may also damage the printed circuit.
remove or replace a component part,
use only enough heat to cause the
solder to flow. Excess heat can
(a) Remove card assembly E2 as
damage the component and may also
follows:
damage the printed circuit card.
1. Unsolder and tag the wires that
(3) Reassembly Procedures.
connect to card assembly E1 and to resistor R44 on the
(a) Replace and solder any wires
chassis; disconnect the shielded wire on the back of
removed from the module connector or between
card assembly E2.
subassemblies during the disassembly or repair
2. Carefully press card assembly
procedures.
E2 out of its location through the side of the module.
(b) Install the subassemblies in their
respective locations and secure each in place with the
NOTE
appropriate hardware. If voltage regulator subassembly
Press the top of the card over the lip
TB1 has been removed, install this assembly before
of the chassis toward the rear of the
attaching subassemblies no. 1 and no. 2 to the module
unit, then work the card upward until
chassis.
the bottom of the card can be
removed over the rim at the bottom
(c) Replace the plastic cover over the
of the module chassis.
module and secure it with the hardware removed earlier.
e. Radio Frequency Oscillator 0-1032/P:RC-47
(3) Reassembly Procedures.
(1) Disassembly Procedures.
(a) If card assembly E2 has been
removed, carefully install the replacement unit in the
(a) Loosen and remove the two 4-40 x
same location.
Refer to figure 3-52 for proper
5/16 pan head screws in the top of the module cover,
orientation o f this card assembly.
then pull the cover from the chassis of the module.
(b) To remove the card assemblies (fig.
NOTE
312 and 3-13), loosen and remove the six 2-56 x 3/16
Before installing card assembly E2,
pan head screws that secure them to the module
be sure that the sponge rubber
chassis; carefully lift each card assembly out of the
covering is installed over the top of
module.
the card and encloses the oscillator
subassembly and its tank circuit
NOTE
components.
The 500-kHz circuits are mounted
directly to the module chassis.
(b) Solder any wires removed from the
Defective individual components of
module connector or between card assemblies during
this circuit may be removed and
disassembly or repair procedures.
replaced
as
required.
If
interconnecting wires between the
(c) Install the card assemblies in their
module
connector
and
the
assigned positions (fig. 3-12).
3-101
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